G Steinlesberger: search on Z-Library

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1

[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Copper damascene interconnects for the 65 nm technology node: a first look at the reliability properties

Steinlesberger, G., von Glasow, A., Engelhardt, M., Schindler, G., Honlein, W., Holz, M., Bertagnolli, E.

Year:

2002

Language:

english

File:

PDF, 228 KB

english, 2002

2

Challenges of interconnection technology till the end of the roadmap and beyond

M Engelhardt, G Schindler, W Steinhögl, G Steinlesberger

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 355 KB

english, 2002

3

Interfacial layers and their effect on leakage current in mocvd-deposited SBT thin films

Bachhofer, Harald, Reisinger, Hans, Steinlesberger, Gernot, Schroeder, Herbert, Nagel, Nicolas, Mdcolajick, Thomas, Cerva, Hans, Philipsborn, Henning Von, Waser, Rainer

Journal:

Integrated Ferroelectrics

Year:

2001

Language:

english

File:

PDF, 509 KB

english, 2001

4

Size-dependent resistivity of metallic wires in the mesoscopic range

Steinhögl, Werner, Schindler, Günther, Steinlesberger, Gernot, Engelhardt, Manfred

Journal:

Physical Review B

Year:

2002

Language:

english

File:

PDF, 88 KB

english, 2002

5

[IEEE 2004 International Conference on Integrated Circuit Design and Technology - Austin, TX, USA (17-20 May 2004)] 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) - Investigation of nano interconnects for an early experimental assessment of future interconnect challenges

Engelhardt, N., Schindler, G., Steinhogl, W., Steinlesberger, G., Traving, M.

Year:

2004

Language:

english

File:

PDF, 315 KB

english, 2004

6

Dielectric relaxation and charge transport mechanisms in (Ba,Sr)TiO 3 thin films

Steinlesberger, Gernot, Reisinger, Hans, Bachhofer, Harald, Schroeder, Herbert, Werner, Wolfgang S. M.

Journal:

Integrated Ferroelectrics

Year:

2001

Language:

english

File:

PDF, 444 KB

english, 2001

7

Impact of line edge roughness on the resistivity of nanometer-scale interconnects

W. Steinhögl, G. Schindler, G. Steinlesberger, M. Traving, M. Engelhardt

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 304 KB

english, 2004

8

Deposition and CMP of sub 100 nm silver damascene lines

R. Emling, G. Schindler, G. Steinlesberger, M. Engelhardt, L. Gao, D. Schmitt-Landsiedel

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 258 KB

english, 2005

9

Electrical characterization of copper interconnects with end-of-roadmap feature sizes

G Schindler, G Steinlesberger, M Engelhardt, W Steinhögl

Journal:

Solid-State Electronics

Year:

2003

Language:

english

File:

PDF, 177 KB

english, 2003

10

Processing technology for the investigation of sub-50 nm copper damascene interconnects

G Steinlesberger, M Engelhardt, G Schindler, J Kretz, W Steinhögl, E Bertagnolli

Journal:

Solid-State Electronics

Year:

2003

Language:

english

File:

PDF, 272 KB

english, 2003

11

Scaling of parasitics and delay times in the backend-of-line

G Schindler, W Steinhögl, G Steinlesberger, M Traving, M Engelhardt

Journal:

Microelectronic Engineering

Year:

2003

Language:

english

File:

PDF, 271 KB

english, 2003

12

A direct liquid, non-equilibrium solid-phase micro-extraction application for analysing chemical variation of single peltate trichomes on leaves of Salvia ofﬁcinalis

Paolo Grassi, Johannes Novak, Heidi Steinlesberger, Chlodwig Franz

Journal:

Phytochemical Analysis

Year:

2004

Language:

english

File:

PDF, 125 KB

english, 2004

13

Tungsten interconnects in the nano-scale regime

W. Steinhögl, G. Steinlesberger, M. Perrin, G. Scheinbacher, G. Schindler, M. Traving, M. Engelhardt

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 234 KB

english, 2005

14

Reliability studies of narrow Cu lines

Günther Schindler, Sabine Penka, Gernot Steinlesberger, Martin Traving, Werner Steinhögl, Manfred Engelhardt

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 255 KB

english, 2005

15

Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes

G. Steinlesberger, M. Engelhardt, G. Schindler, W. Steinhögl, A. von Glasow, K. Mosig, E. Bertagnolli

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 364 KB

english, 2002

16

Plasmolysestudien an laubmoosen

Erna Steinlesberger

Journal:

Year:

1959

Language:

german

File:

PDF, 5.32 MB

german, 1959

17

Plasmolysestudien an Laubmoosen

Erna Steinlesberger

Journal:

Year:

1959

Language:

german

File:

PDF, 1.44 MB

german, 1959

18

Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller

SteinhoÌgl, W., Schindler, G., Steinlesberger, G., Traving, M., Engelhardt, M.

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 1.21 MB

english, 2005

19

[IEEE IEEE International Conference on Simulation of Semiconductor Processes and Devices - Boston, MA, USA (2003.09.3-2003.09.5)] International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. - Scaling laws for the resistivity increase of sub-100 nm interconnects

Steinhoegl, W., Schindler, G., Steinlesberger, G., Traving, M., Engelhardt, M.

Year:

2003

Language:

english

File:

PDF, 317 KB

english, 2003

20

[IEEE International Electron Devices Meeting. Technical Digest - Washington, DC, USA (2-5 Dec. 2001)] International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224) - A comparative study of dielectric relaxation losses in alternative dielectrics

Reisinger, H., Steinlesberger, G., Jakschik, S., Gutsche, M., Hecht, T., Leonhard, M., Schroder, U., Seidl, H., Schumann, D.

Year:

2001

Language:

english

File:

PDF, 333 KB

english, 2001

21

[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Aluminum nano interconnects

Steinlesberger, G., Schindler, G., Engelhardt, M., Steinhogl, W., Traving, M.

Year:

2004

Language:

english

File:

PDF, 333 KB

english, 2004

22

[ECS 208th ECS Meeting - Los Angeles, California (October 16-October 21, 2005)] ECS Transactions - Fabrication of Deep Sub-lithographic Al-Based Nanointerconnects Utilizing a Wet Chemical Hard Mask Trim Process

Engelhardt, Manfred, Steinlesberger, Gernot, Kirchner, Udo

Year:

2006

Language:

english

File:

PDF, 427 KB

english, 2006

23

Electrical Behavior of Nano-Scaled Interconnects

Engelhardt, M., Schindler, G., Steinhögl, W., Steinlesberger, G., Traving, M.

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 302 KB

english, 2004

24

[IEEE International Reliability Physics Symposium - Dallas, TX, USA (30 March-4 April 2003)] 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual. - Using the temperature coefficient of the resistance (TCR) as early reliability indicator for stressvoiding risks in Cu interconnects

von Glasow, A., Fischer, A.H., Steinlesberger, G.

Year:

2003

Language:

english

File:

PDF, 493 KB

english, 2003

25

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., Traving, M., Hönlein, W., Bertagnolli, E.

Journal:

MRS Proceedings

Year:

2003

Language:

english

File:

PDF, 1.00 MB

english, 2003

26

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., Traving, M., Hönlein, W., Bertagnolli, E.

Journal:

MRS Proceedings

Year:

2003

File:

PDF, 1.00 MB

2003